How to configure link aggregation or bonding on the Kemp LoadMaster
The LoadMaster has the ability to bond its interfaces together to provide for additional throughput as well as redundancy. The LoadMaster supports two styles of bonding: 802.3ad and Active-Backup.
Before creating a bonded interface please note the following:
- You can only bond interfaces higher than the parent, so if you choose to start with port 10 then you can only add ports 11 and greater
- Bond links first. If you need VLAN tagging, add VLANs after the bond has been configured
- In order to add a link to a bonded interface, any IP addressing must first be removed from the link to be added
- Enabling the Active-Backup mode generally does not require switch intervention
- Bonding eth0 with eth1 can lead to serious issues and is not allowed to occur
To configure an interface for use with bonding, follow the steps below in the LoadMaster Web User Interface (WUI):
- In the main menu, select System Configuration.
- Select the lowest indexed interface you want to use, for example eth0.
- Click the Interface Bonding button.
- Click Create a bonded interface.
This will turn eth* to bnd*.
- In the main menu, select System Configuration and bnd*.
- Configure the addressing as needed.
- To add interfaces or to modify the bond type click Bonded Devices.
- You can select the style of bonding in the Bonding mode drop-down list:
- 802.3ad – True bonding which aggregates the bandwidth of multiple interfaces. Both interfaces must connect to the same switch and the switch ports must be configured to support this.
- Active-backup – This style of bonding allows for link redundancy but does not aggregate the bonded interfaces. Each link can be connected to a different switch for full redundancy. No switch configuration is required for this.